Resumen
This study seeks to examine the mechanical properties of adobe compacted with wheat straw, pine needles and their mixtures in proportions of 0.3%, 0.5% and 0.8% subjected to compression and bending. Earth from the Cruz Blanca quarry in Cajamarca was used. Moisture content tests, granulometric analysis, plasticity limits, relative specific gravity of solids and modified proctor were carried out. Knowing the properties of the material, 120 samples of compacted adobe were manufactured with the CINVA RAM machine, drying for 28 days before performing compression and bending tests, obtaining positive results. In the compression test, adobes with 0.3%, 0.5% and 0.8% wheat straw showed increases of 47.08%, 68.16% and 27.29%, while with pine needles the increases were 26.63%, 41.87% and 45.12%. By combining both, an increase of 28.44%, 45.27% and 66.49% was achieved. For the bending tests, increments of 0.3%, 0.5% and 0.8% of wheat straw were used, obtaining values of 5.06% and 9.27%. and 60.67%, when adding pine needles the values 21.07%, 25.28% and 52.81 are obtained, and finally for the combination of elements the values 49.72%, 57.87% and 44.94% are presented. So we come to the conclusion that we have validated the hypothesis, these values satisfy the minimum requirements established by the standard.
| Título traducido de la contribución | Compacted adobe using wheat straw, pine and their combination |
|---|---|
| Idioma original | Español |
| Publicación | Proceedings of the LACCEI international Multi-conference for Engineering, Education and Technology |
| N.º | 2025 |
| DOI | |
| Estado | Publicada - 2025 |
| Evento | 23rd LACCEI International Multi-Conference for Engineering, Education and Technology, LACCEI 2025 - Virtual, Online Duración: 16 jul. 2025 → 18 jul. 2025 |
Palabras clave
- bending
- compacted adobe
- compression
- pine needles
- Wheat straw
Huella
Profundice en los temas de investigación de 'Adobe compactado con el uso de paja de trigo, pino y su combinación'. En conjunto forman una huella única.Citar esto
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